Media Summary: Thank you a lot um so i just want to give a little bit of Okay so um the big changes we've made this uh in the So um welcome this is uh the advanced cooling uh facilities uh incubation team uh

Ocp 2020 Tech Week Introduction - Detailed Analysis & Overview

Thank you a lot um so i just want to give a little bit of Okay so um the big changes we've made this uh in the So um welcome this is uh the advanced cooling uh facilities uh incubation team uh OCP 2020 Tech Week: Bring JBOG modularity to your system Speakers: Xin Liu (Principal PM, Microsoft), Xiong Yongqiang (Senior Principal Researcher/Research Manager Microsoft ... Nokia Open Edge switch - Highligths Nokia Open Edge switch is highly integrated,robust solution for Edge deployments ...

Photo Gallery

OCP 2020 Tech Week: ACS Introductions and Welcome
OCP 2020 Tech Week: Welcome and Introductions - Networking Project
OCP 2020 Tech Week: Rack & Power: Introduction & Welcome
OCP 2020 Tech Week: Die-to-Die Interface Comparison: 2020 Update
OCP 2020 Tech Week: OCP 2021 Technical Initiatives
OCP 2020 Tech Week: Introduction/Welcome to Advanced Cooling Facility (ACF) Sub-Project and Charter
OCP 2020 Tech Week: Introduction to ODSA OpenHBI High Performance Chip-to-Chip Interconnect
OCP 2020 Tech Week: Bring JBOG modularity to your system
2020 OCP TECH WEEK China Day: SONiC Development and Outlook (Microsoft)
OCP 2020 Tech Week: OCP Ready™ Guidelines Revision Presentation
OCP 2020 Tech Week: Open Edge Switch
OCP 2020 Tech Week: An Open Chiplet Link Layer
View Detailed Profile
OCP 2020 Tech Week: ACS Introductions and Welcome

OCP 2020 Tech Week: ACS Introductions and Welcome

Thank you a lot um so i just want to give a little bit of

OCP 2020 Tech Week: Welcome and Introductions - Networking Project

OCP 2020 Tech Week: Welcome and Introductions - Networking Project

Started uh welcome everyone to

OCP 2020 Tech Week: Rack & Power: Introduction & Welcome

OCP 2020 Tech Week: Rack & Power: Introduction & Welcome

Oh

OCP 2020 Tech Week: Die-to-Die Interface Comparison: 2020 Update

OCP 2020 Tech Week: Die-to-Die Interface Comparison: 2020 Update

Okay so um the big changes we've made this uh in the

OCP 2020 Tech Week: OCP 2021 Technical Initiatives

OCP 2020 Tech Week: OCP 2021 Technical Initiatives

Introduction

OCP 2020 Tech Week: Introduction/Welcome to Advanced Cooling Facility (ACF) Sub-Project and Charter

OCP 2020 Tech Week: Introduction/Welcome to Advanced Cooling Facility (ACF) Sub-Project and Charter

So um welcome this is uh the advanced cooling uh facilities uh incubation team uh

OCP 2020 Tech Week: Introduction to ODSA OpenHBI High Performance Chip-to-Chip Interconnect

OCP 2020 Tech Week: Introduction to ODSA OpenHBI High Performance Chip-to-Chip Interconnect

Introduction

OCP 2020 Tech Week: Bring JBOG modularity to your system

OCP 2020 Tech Week: Bring JBOG modularity to your system

OCP 2020 Tech Week: Bring JBOG modularity to your system

2020 OCP TECH WEEK China Day: SONiC Development and Outlook (Microsoft)

2020 OCP TECH WEEK China Day: SONiC Development and Outlook (Microsoft)

Speakers: Xin Liu (Principal PM, Microsoft), Xiong Yongqiang (Senior Principal Researcher/Research Manager Microsoft ...

OCP 2020 Tech Week: OCP Ready™ Guidelines Revision Presentation

OCP 2020 Tech Week: OCP Ready™ Guidelines Revision Presentation

... for the it

OCP 2020 Tech Week: Open Edge Switch

OCP 2020 Tech Week: Open Edge Switch

Nokia Open Edge switch - Highligths • Nokia Open Edge switch is highly integrated,robust solution for Edge deployments ...

OCP 2020 Tech Week: An Open Chiplet Link Layer

OCP 2020 Tech Week: An Open Chiplet Link Layer

Introduction

OCP 2020 Tech Week: Open Discussion: ACS

OCP 2020 Tech Week: Open Discussion: ACS

OCP 2020 Tech Week: Open Discussion: ACS